Manufacturing method of device

ABSTRACT

A device manufacturing method includes: sequentially forming a first sacrificial film, a first support film, a second sacrificial film, and a second support film on a semiconductor substrate; forming a hole to pass through these films; forming a crown-shaped electrode covering an inner surface of the hole and connected to the second support film and the first support film; forming a first opening in the second support film into a first pattern designed such that the connection between the crown-shaped electrode and the second support film is at least partially maintained; removing at least a part of the second sacrificial film through the first opening; forming a second opening in the first support film with use of the first opening; and removing the first sacrificial film through the second opening. This method is able to prevent misalignment of openings between the support films.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a continuation of Ser. No. 13/553,916 filed on Jul.20, 2012, which claims priority to prior Japanese application JP2011-164572 filed on Jul. 27, 2011. The disclosure of which isincorporated herein by reference.

BACKGROUND OF THE INVENTION

This invention relates to a manufacturing method of a semiconductordevice, and in particular to a manufacturing method of a semiconductordevice having a structure, in which lower electrodes of crown-shapedcapacitors are supported by a plurality of support films.

In a related-art semiconductor device manufacturing method, pluralinsulator beams are formed sequentially from the lower layer side. Thistype of technique is disclosed for example in Japanese Laid-Open PatentPublication No. 2003-142605.

More specifically, a first insulating beam film is formed on a firstsacrificial insulating film and then the first insulating beam film isselectively etched to form a first insulator beam having a desiredpattern. Subsequently, a second sacrificial insulating film and a secondinsulating beam film are sequentially formed on the first insulator beamand the exposed first sacrificial insulating film. In the same manner asfor the first insulating beam film, the second insulating beam film isselectively etched to form a second insulator beam having a desiredpattern.

Subsequently, through holes are formed to pass through the secondinsulator beam, the second sacrificial insulating film, the firstinsulator beam and the first sacrificial insulating film, and aconductive film functioning as lower electrodes of capacitors is formedso as to cover the inner surfaces of the through holes. The conductivefilm thus formed is connected to the second insulator beam and firstinsulator beam exposed in the through holes.

After that, the lower electrodes can be supported by the secondinsulator beam and first insulator beam even if the second sacrificialinsulating film and the first sacrificial insulating film are removed.Thus, the lower electrodes can be prevented from collapsing, andcrown-shaped capacitors having a higher aspect ratio can be formed.

SUMMARY OF THE INVENTION

According to the related-art manufacturing method of a semiconductordevice, a plurality of insulator beams are formed one by one from thelower layer side and then through holes are formed therein. If thereoccurs a misalignment between the position of an insulator beam patternand the position where the through hole is formed, a lower electrodeformed within the through hole will possibly not be connected to any orall of the insulator beams. It is expected that such a problem willoccur more frequently as the miniaturization of semiconductor devices isadvanced.

In one embodiment, there is provided a method that includes:sequentially forming a first sacrificial film, a first support film, asecond sacrificial film, and a second support film on a semiconductorsubstrate; forming a hole to pass through the second support film, thesecond sacrificial film, the first support film, and the firstsacrificial film; forming a crown-shaped electrode covering an innersurface of the hole and connected to the second support film and thefirst support film; forming a first opening in the second support filminto a first pattern which is designed such that a connection betweenthe crown-shaped electrode and the second support film is at leastpartially maintained; removing at least a part of the second sacrificialfilm through the first opening; forming a second opening in the firstsupport film with use of the first opening; and removing the firstsacrificial film through the second opening.

In another embodiment, there is provided a method that includes:stacking alternately a plurality of sacrificial films and a plurality ofsupport films; forming a crown-shaped electrode which passes through theplurality of sacrificial film layers and the plurality of support filmlayers and is connected to the plurality of support film layers; forminga first opening in an uppermost layer of the plurality of support filmlayers, into a first pattern which is designed such that the connectionwith the crown-shaped electrode is at least partially maintained;forming a corresponding opening corresponding to the first opening ineach of the plurality of support film layers except for the upper mostlayer with use of the first opening such that the connection with thecrown-shaped electrode is at least partially maintained for all of theplurality of support film layers except for the upper most layer; andremoving the plurality of sacrificial films through the first openingand the corresponding opening.

BRIEF DESCRIPTION OF THE DRAWINGS

The above features and advantages of the present invention will be moreapparent from the following description of certain preferred embodimentstaken in conjunction with the accompanying drawings, in which:

FIG. 1A is a flowchart showing primary steps of a manufacturing methodaccording to this invention;

FIG. 1B is a flowchart showing primary steps of a related-artmanufacturing method of a semiconductor device;

FIG. 2A is a diagram for explaining a manufacturing method of asemiconductor device according to a first embodiment of the invention,being a plan view showing a semiconductor device on the way ofmanufacture;

FIG. 2B is a cross-sectional view taken along the line B-B′ in FIG. 2A;

FIG. 3A is a diagram for explaining steps following the steps shown inFIGS. 2A and 2B, being a plan view showing a semiconductor device on theway of manufacture;

FIG. 3B is a cross-sectional view taken along the line B-B′ in FIG. 3A;

FIG. 4A is a diagram for explaining steps following the steps shown inFIGS. 3A and 3B, being a plan view showing a semiconductor device on theway of manufacture;

FIG. 4B is a cross-sectional view taken along the line B-B′ in FIG. 4A;

FIG. 5A is a diagram for explaining steps following the steps shown inFIGS. 4A and 4B, being a plan view showing a semiconductor device on theway of manufacture;

FIG. 5B is a cross-sectional view taken along the line B-B′ in FIG. 5A;

FIG. 6A is a diagram for explaining steps following the steps shown inFIGS. 5A and 5B, being a plan view showing a semiconductor device on theway of manufacture;

FIG. 6B is a cross-sectional view taken along the line B-B′ in FIG. 6A;

FIG. 7A is a diagram for explaining steps following the steps shown inFIGS. 6A and 6B, being a plan view showing a semiconductor device on theway of manufacture;

FIG. 7B is a cross-sectional view taken along the line B-B′ in FIG. 7A;

FIG. 8A is a diagram for explaining steps following the steps shown inFIGS. 7A and 7B, being a plan view showing a semiconductor device on theway of manufacture;

FIG. 8B is a cross-sectional view taken along the line B-B′ in FIG. 8A;

FIG. 9A is a diagram for explaining steps following the steps shown inFIGS. 8A and 8B, being a plan view showing a semiconductor device on theway of manufacture;

FIG. 9B is a cross-sectional view taken along the line B-B′ in FIG. 9A;

FIG. 10A is a diagram for explaining steps following the steps shown inFIGS. 9A and 9B, being a plan view showing a semiconductor device on theway of manufacture;

FIG. 10B is a cross-sectional view taken along the line B-B′ in FIG.10A;

FIG. 11 is an enlarged view of a part of FIG. 10A;

FIG. 12A is a diagram for explaining steps following the steps shown inFIGS. 10A and 10B, being a plan view showing a semiconductor device onthe way of manufacture;

FIG. 12B is a cross-sectional view taken along the line B-B′ in FIG.12A;

FIG. 13 is a cross-sectional view for explaining steps following thesteps shown in FIGS. 12A and 12B;

FIG. 14A is a diagram for explaining a manufacturing method of asemiconductor device according to a second embodiment of the invention,being a plan view showing a semiconductor device on the way ofmanufacture;

FIG. 14B is a cross-sectional view taken along the line B-B′ in FIG.14A;

FIG. 15A is a diagram for explaining steps following the steps shown inFIGS. 14A and 14B, being a plan view showing a semiconductor device onthe way of manufacture;

FIG. 15B is a cross-sectional view taken along the line B-B′ in FIG.15A;

FIG. 16A is a diagram for explaining steps following the steps shown inFIGS. 15A and 15B, being a plan view showing a semiconductor device onthe way of manufacture;

FIG. 16B is a cross-sectional view taken along the line B-B′ in FIG.16A;

FIG. 17 is a cross-sectional view for explaining problems pertaining tosemiconductor devices studied by the inventor;

FIG. 18A is a diagram for explaining a manufacturing method of asemiconductor device according to a third embodiment of the invention,being a plan view showing a semiconductor device on the way ofmanufacture;

FIG. 18B is a cross-sectional view taken along the line B-B′ in FIG.18A;

FIG. 19A is a diagram for explaining steps following the steps shown inFIGS. 18A and 18B, being a plan view showing a semiconductor device onthe way of manufacture;

FIG. 19B is a cross-sectional view taken along the line B-B′ in FIG.19A;

FIG. 20A is a diagram for explaining steps following the steps shown inFIGS. 19A and 19B, being a plan view showing a semiconductor device onthe way of manufacture; and

FIG. 20B is a cross-sectional view taken along the line B-B′ in FIG.20A.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

Exemplary preferred embodiments of the invention will be described withreference to the accompanying drawings.

Referring to FIGS. 1A and 1B, this invention will be schematicallydescribed in comparison with a related-art semiconductor devicemanufacturing method in order to facilitate understanding of theinvention.

FIG. 1A is a flowchart illustrating primary steps of a manufacturingmethod of a semiconductor device according to the invention, while FIG.1B is a flowchart illustrating primary steps of the related-artmanufacturing method of a semiconductor device. The manufacturing methodof the invention aims to perform a patterning lithography (PR) processfor a plurality of support films in a single step, which hasconventionally been carried out in a plurality of steps.

The related-art semiconductor device manufacturing method will beschematically described below.

Firstly, a first cylinder interlayer film (first sacrificial film) isformed on a semiconductor substrate (step B101), and a first supportfilm is formed thereon (step B102).

Next, a photoresist mask having a first beam pattern is formed on thefirst support film by photolithography (PR) (step B103). The firstsupport film is then etched by dry etching using the photoresist mask toform a first beam made of the first support film (step B104). The firstbeam pattern is a lattice pattern formed by straight lines which arerepeatedly arranged in X and Y directions. Cylinder holes are formed atintersections of this lattice pattern in a later step.

Subsequently, a second cylinder interlayer film (second sacrificialfilm) is formed on the entire surface to cover the first beam (stepB105), and a second support film is formed thereon (step B106).

Next, a second beam made of a second support film is formed by the samesteps as steps B103 and B104 (steps B107 and B108). The second beampattern is the same as the first beam pattern.

Subsequently, a photoresist mask having a cylinder hole pattern isformed by photolithography (PR) on the second support film and theexposed second cylinder interlayer film (step B109). The second beam,the second cylinder interlayer film, the first beam, and the firstcylinder interlayer film are etched sequentially by dry etching usingthe photoresist mask to form cylinder holes (step B110).

A conductor film is formed on the entire surface including the innersurface of the cylinder holes, and then the conductor formed on thesecond support film is removed while the conductors are left only on theinner surfaces of the cylinder holes, whereby lower electrodes areformed (step B111). As a result, the lower electrodes are in contactwith the first and the second beams. Specifically, each of the lowerelectrodes has an outer peripheral surface. The outer peripheral surfaceis in contact with linear beams (or the first beam), which extend in theX and Y directions, at four points. Similarly, the outer peripheralsurface is in contact with linear beams (or the second beam), whichextend in the X and Y directions, at four points.

Next, the second cylinder interlayer film and the first cylinderinterlayer film are removed by solution etching (step B112). The secondcylinder interlayer film and the first cylinder interlayer film may beeach made of a silicon oxide film while the first beam and the secondbeam may be each made of a silicon nitride film. Therefore, the secondcylinder interlayer film and the first cylinder interlayer film can beselectively removed with the first and second beams left unremoved. Thelower electrodes are supported (interconnected) by the first and secondbeams, whereby the lower electrodes can be prevented from collapsing dueto removal of the second cylinder interlayer film and the first cylinderinterlayer film.

Next, a capacity insulating film is formed on the surface of a structureconsisting of the lower electrodes, the first beam, and the second beam(step B113). An upper electrode is then formed to cover the surface ofthe capacity insulating film (step B114).

Capacitors having crown-shaped lower electrodes are fabricated in thismanner.

In contrast, in a manufacturing method of a semiconductor deviceaccording to this invention, a second cylinder interlayer film is formedwithout performing PR for formation of the first beam pattern or thefirst beam formation (steps B103 and B104) (step A103).

In addition, according to the method of the invention, steps of PR forcylinder hole pattern formation (step A106), cylinder hole formation(step A107), and lower electrode formation (step A108) are performedprior to steps (steps A109 and A110) corresponding to the PR for secondbeam pattern formation and the second beam formation (steps B107 andB108). For this purpose, a third cylinder interlayer film formation step(step A105) is additionally provided. This step does not requirealignment.

After this, PR for etching opening pattern formation corresponding tothe PR for second beam pattern formation is performed to form an etchingmask (step A109), and an opening pattern is formed on the second supportfilm by using this etching mask (step A110). Further, using the firstopening formed in the second support film, removal of the secondcylinder interlayer film, formation of a second opening in the firstsupport film, and removal of the first cylinder interlayer film arecarried out (step A111). The formation of the second opening isimplemented by anisotropic dry etching.

After that, formation of a capacity insulating film (step A112) andformation of an upper electrode (step A113) are performed, wherebycapacitors having crown-shaped lower electrodes are completed.

According to the manufacturing method of a semiconductor device of theinvention as described above, the PR processes for formation of thefirst beam can be omitted. This makes it possible to prevent occurrenceof deficiency due to misalignment that might possibly be caused during aplurality of PR processes.

Next, a manufacturing method of a semiconductor device according to afirst embodiment of the invention will be described with reference toFIGS. 2A to 13. Although the following description will be made in termsof a DRAM (Dynamic Random Access Memory) as an example of asemiconductor device, the invention is applicable to semiconductordevices other than DRAM as long as they are configured such that astructure having a high aspect ratio is supported by means of aplurality of support films. Dry etching used in this embodiment is usedfor performing anisotropic etching.

A DRAM has a memory cell area in which a plurality of memory cells arearranged, and a peripheral circuit area for driving the memory cells.Each of FIGS. 2A to 12B except FIG. 11 partially illustrates an areaaround the periphery between the memory area and the peripheral circuitarea in a DRAM which is being fabricated. FIGS. 2A to 12A (drawings witha suffix of A) are plan views, while FIGS. 2B to 12B (drawings with asuffix of B) are cross-sectional views taken along the line B-B′ incorresponding drawings with a suffix of A.

Firstly, a state as shown in FIGS. 2A and 2B is obtained by using aknown technique.

More specifically, an element isolation region 1 a, buried gateelectrodes 1 b, diffusion regions 1 c and so on are formed on asemiconductor substrate 1. An interlayer insulation film 2 is formed onthe semiconductor substrate 1 and, further, capacity contact plugs 2 apassing through the interlayer insulation film 2 and a peripheral wiring3 are formed thereon. A stopper silicon nitride film 4, a first cylinderinterlayer film (first sacrificial film) 5, a first silicon nitride film(first support film) 6, a second cylinder interlayer film (secondsacrificial film) 7, a second silicon nitride film (second support film)8, a third cylinder interlayer film 9, an amorphous carbon film 10, anda silicon oxide film 11 are sequentially stacked thereon. After that, aphotoresist 12 is formed on the silicon oxide film 11, and a cylinderhole pattern 13 is formed in the photoresist 12.

In this embodiment, neither the first silicon nitride film 6 nor thesecond silicon nitride film 8 is subjected to a pattern formationprocess, but the second cylinder interlayer film 7 and the thirdcylinder interlayer film 9 are formed on the upper faces thereof,respectively.

The semiconductor substrate 1 is, for example, a p-type single crystalsilicon substrate. The semiconductor substrate 1 is electricallyseparated into a memory cell area 101 and a peripheral circuit area 102by means of an element isolation region 1 a.

The buried gate electrodes 1 b and the diffusion regions 1 c formed inthe memory cell area 101 form transistors. The buried gate electrodes 1b also function as word lines. The capacity contact plugs 2 a areconnected to the diffusion regions 1 c, and also connected to bit lines(not shown).

The stopper silicon nitride film 4 is formed into a thickness of 50 nmon the entire surface of the semiconductor substrate 1 by using a CVD(Chemical Vapor Deposition) process, for example.

The first cylinder interlayer film 5 is, for example, animpurity-containing silicon oxide film, and is formed into a thicknessof 450 nm by using a CVD process. The impurity-containing silicon oxidefilm may be made of BPSG (Boro-Phospho Silicate Glass) containing boron(B) and phosphorus (P). Since the impurity-containing silicon oxide filmis etched rapidly with an etching solution, it can be removed easily ina later process.

The first silicon nitride film 6 is formed, for example, by a CVDprocess into a thickness of 50 nm. The first silicon nitride film 6 canbe formed by a sputtering method or a HDP (High Density Plasma) process.A film formed by sputtering or HDP is very dense, and can be etched witha solution at a lower etching rate than a film formed by a CVD process.Unlike the related-art semiconductor device manufacturing method, thefirst silicon nitride film is not patterned at this point.

The second cylinder interlayer film 7 and the second silicon nitridefilm 8 are formed into a thickness of thickness 450 nm and a thicknessof 50 nm, respectively, by the same methods as the first cylinderinterlayer film 5 and the first silicon nitride film 6. The secondsilicon nitride film 8 is not patterned either at this point.

The third cylinder interlayer film 9 is, for example, a silicon oxidefilm, and is formed by a CVD process into a thickness of 30 nm.Alternatively, the third cylinder interlayer film 9 may be formed by asputtering method or a HDP process.

The amorphous carbon film 10 is formed, for example, by a CVD processinto a thickness of 1000 nm.

The silicon oxide film 11 is formed into a thickness of 50 nm, forexample, by a CVD process.

The cylinder hole pattern 13 in the photoresist 12 is formed, forexample, by using a lithography process. Openings forming the cylinderhole pattern 13 each correspond to a position where a capacitor is to beformed, and are formed in the memory cell area 101. As shown in FIG. 2A,a multiplicity of the openings may be arranged in a close-packed manner.The openings may have a diameter of 50 to 150 nm, and the closestdistance between adjacent openings may be 30 to 50 nm. In such aclose-packed pattern in which a multiplicity of the openings arearranged in a staggered fashion, the distance between adjacent openings,that is, the distance between capacitors is small, and hence it isdifficult to arrange linear beams repeatedly in X and Y direction as inthe aforementioned related-art semiconductor device manufacturingmethod. This embodiment employs a configuration, as described later, inwhich openings are formed in the support film so that support isprovided by a plane instead of the beams.

Next, the silicon oxide film 11 is etched with the photoresist 12 usedas a mask by a dry etching process using fluorine-containing plasma, sothat the cylinder hole pattern 13 in the photoresist 12 is transferredto the silicon oxide film 11. As a result, a part of the upper surfaceof the amorphous carbon film 10 is exposed in the bottoms of the holes.

Subsequently, the exposed amorphous carbon film 10 is etched by a dryetching process using oxygen plasma so that the cylinder hole pattern 13is transferred to the amorphous carbon film 10. The photoresist 12 usedas the mask disappears during etching of the amorphous carbon film 10.However, the silicon oxide film 11, which is not etched by oxygenplasma, functions as a new mask even though it is thin. Therefore, theamorphous carbon film 10 can be etched according to the cylinder holepattern 13 until a part of the upper surface of the third cylinderinterlayer film 9 is exposed in the bottoms of the holes.

Subsequently, by using, as a mask, the amorphous carbon film 10 havingthe cylinder hole pattern 13 transferred thereto and the silicon oxidefilm 11 left unetched on the upper surface thereof, the third cylinderinterlayer film 9, the second silicon nitride film 8, the secondcylinder interlayer film 7, the first silicon nitride film 6, the firstcylinder interlayer film 5, and the stopper silicon nitride film 4 areetched sequentially by a dry etching process using fluorine-containingplasma. As a result of this, cylinder holes (indicated by 14 in FIG. 3B)are formed to reach the capacity contact plugs 2 a, while the uppersurfaces of the capacity contact plugs 2 a are partially exposed in theholes. The silicon oxide film 11 used as the mask disappears during theetching, but the amorphous carbon film 10 remains unetched and functionsas a mask.

After etching the stopper silicon nitride film 4, the amorphous carbonfilm 10 left unetched as a mask is removed by an oxygen plasma dryetching process so that the upper surface of the third cylinderinterlayer film 9 is exposed. As a result of this, a state shown inFIGS. 3A and 3B is obtained.

Although in this embodiment, the amorphous carbon film 10 is used as amask for forming the cylinder holes 14, the invention is not limited tothis, and a silicon film, a film of a metal silicide such as tungstensilicide or titanium silicide, a film of a metal compound such astitanium nitride or tungsten nitride, or a film of a metal such asaluminum, tungsten, or nickel can be used. Since a film of a metallicmaterial is difficult to be etched or is not etched at all by fluorineplasma, such a film is effective as a mask and desirable for highprecision processing of the cylinder holes 14.

As shown in FIGS. 4A and 4B, a lower electrode material film 15 isformed on the entire surface including the upper surface of the thirdcylinder interlayer film 9 and the inner surfaces of the cylinder holes14. Titanium nitride can be used as the material of the lower electrodematerial film 15. The formation of the lower electrode material film 15can be performed by a CVD process or an ALD (Atomic Layer Deposition)process. The thickness of the lower electrode material film 15 isselected in such a range that the total of the thickness of the lowerelectrode material film 15 and the thickness of the capacity insulatingfilm to be formed in a later step is smaller than a half of the diameterof the cylinder holes. For example, the thickness of the lower electrodematerial film 15 may be 10 nm.

Then, the lower electrode material film 15 is entirely etched back sothat, as shown in FIGS. 5A and 5B, the lower electrode material film 15formed on the upper surface of the third cylinder interlayer film 9 isremoved. This etching back can be performed by a dry etching processusing chlorine-containing plasma. As a result of this, crown-shapedlower electrodes 16 can be formed, which cover the inner surfaces of therespective cylinder holes 14 and are connected to the upper surfaces ofthe capacity contact plugs 2 a. The outer peripheral surface of each ofthe lower electrodes 16 is connected to the first silicon nitride film 6and the second silicon nitride film 8.

Next, as shown in FIGS. 6A and 6B, a plasma silicon nitride film 17, ananti-reflection film 18, and a photoresist 19 are sequentially formed onthe entire upper surface of the third cylinder interlayer film 9.

The plasma silicon nitride film 17 is formed, for example, by a plasmaCVD process into a thickness of 150 nm. Since this method is poor instep coverage, the plasma silicon nitride film 17 is not formed in theinside of the lower electrodes 16 but is formed to close the openings ofthe lower electrodes 16.

The anti-reflection film 18 is formed on the entire upper surface of theplasma silicon nitride film 17 by a spin-coating method, for example.

The photoresist 19 is formed, for example, by a spin-coating method onthe entire upper surface of the anti-reflection film 18. An etchingopening pattern 20 is formed in the photoresist 19 by a photolithographyprocess. The photoresist 19 located in the peripheral circuit area 102is also removed during formation of the etching opening pattern 20.

The etching opening pattern 20 defines openings for etching away thecylinder interlayer films 9, 7 and 5 in a later step. This means thatthe etching opening pattern 20 define openings to be formed in the firstand second silicon nitride films 6 and 8. Since the first and secondsilicon nitride films 6 and 8 function as support films for supportingthe lower electrodes 16, the openings formed therein should be as smallas possible. Therefore, the etching opening pattern 20 is designed suchthat the openings formed in the first and second silicon nitride films 6and 8 have a minimum necessary area. Whereas in the related-artsemiconductor device manufacturing method, the lower electrodes aresupported by the beams, the lower electrodes are supported by a plane inthis embodiment. The area of the remaining part of each of the first andsecond silicon nitride films 6 and 8 should be greater at least than thearea of the openings. FIG. 6A shows an example in which the openingshave an oblong shape with rounded corners.

Next, the anti-reflection film 18 and the plasma silicon nitride film 17are sequentially dry etched with the photoresist 19 used as a mask, sothat the etching opening pattern 20 is transferred to theanti-reflection film 18 and the plasma silicon nitride film 17.Fluorine-containing plasma can be used for this etching. After that, thephotoresist 19 used as the mask and the anti-reflection film 18 areremoved by dry etching using oxygen plasma. As a result, a state asshown in FIGS. 7A and 7B is obtained.

As shown in FIGS. 7A and 7B, a part of the upper surface of the thirdcylinder interlayer film 9 and a part of the upper surface of each lowerelectrode 16 are exposed in each of openings 20 a formed in the plasmasilicon nitride film 17. The upper surface of the third cylinderinterlayer film 9 is exposed in the peripheral circuit area 102.

As shown in FIGS. 8A and 8B, the exposed third cylinder interlayer film9 is then dry etched with the plasma silicon nitride film 17 used as amask, and subsequently the second silicon nitride film 8 is dry etched.Fluorine-containing plasma can be used for this etching process. As aresult of this, first openings according to the etching opening pattern20 is formed in the second silicon nitride film 8, whereby the uppersurface of the second cylinder interlayer film 7 is partially exposed.In this step, the thickness of the plasma silicon nitride film 17 isreduced to about a half of the original thickness when it is formed.

The dry etching process using fluorine-containing plasma with the plasmasilicon nitride film 17 used as a mask is continued so that, as shown inFIGS. 9A and 9B, the exposed second cylinder interlayer film 7 and firstsilicon nitride film 6 are sequentially dry etched. As a result of this,second openings according to the etching opening pattern 20 are formedin the first silicon nitride film 6, and the upper surface of the firstcylinder interlayer film 5 is partially exposed.

The plasma silicon nitride film 17 used as the mask also disappears bybeing etched away during this process. In other words, the originalthickness of the plasma silicon nitride film 17 when it is formed iscontrolled such that the plasma silicon nitride film 17 disappears atthis stage of the process. If the plasma silicon nitride film 17 doesnot disappear completely and partially remains, isotropic plasma etchingis additionally performed to completely remove the remaining plasmasilicon nitride film 17. Since the upper surface of the second siliconnitride film 8 is covered with the third cylinder interlayer film 9 madeof a silicon oxide film, the second silicon nitride film 8 will not beetched from the upper surface thereof and will not disappear even afterthis additional etching.

In this manner, the etching openings 21 can be formed in common in thesecond silicon nitride film 8 and first silicon nitride film 6 by asingle dry etching process. In each of the etching openings 21, thereare exposed a side wall of the second cylinder interlayer film 7 and apart of the upper surface of the first cylinder interlayer film 5, andalso parts of the upper surface and the outer wall of the lowerelectrode 16. Further, the upper surfaces of the lower electrodes 16 areexposed in the memory cell area other than the etching openings 21.

As shown in FIGS. 10A and 10B, the third cylinder interlayer film 9, thesecond cylinder interlayer film 7 and the first cylinder interlayer film5 which are made of silicon oxide films are entirely removed by a wetetching process using a hydrofluoric-acid-containing solution.

In the case of wet etching using a hydrofluoric-acid-containingsolution, the etching rate of a silicon nitride film is as low as about1/100 of the etching rate of a silicon oxide film. The lower electrode16 made of a metal material is not etched with thehydrofluoric-acid-containing solution. Therefore, the first cylinderinterlayer film 5, the second cylinder interlayer film 7 and the thirdcylinder interlayer film 9 made of silicon oxide films can beselectively removed by the wet etching using thehydrofluoric-acid-containing solution.

As a result, the plurality of lower electrodes 16 formed in the memorycell area are connected at their upper parts to a first support member30 formed of the second silicon nitride film 8, and are interconnectedwhile they are connected at their central parts to a second supportmember 31 formed of the first silicon nitride film 6. The outer walls ofthe plurality of lower electrodes 16 are totally exposed except theparts thereof connected to the support members 30 and 31. Structuresincluding transistors and wirings formed on the semiconductor substrate1 are covered with the stopper silicon nitride film 4 and hence will notbe etched away.

The etching opening pattern 20, that is, the etching openings 21 for thesupport members 30 and 31 to be eventually formed will be described indetail with reference to FIG. 11.

FIG. 11 is a diagram showing in an enlarged fashion a part of FIG. 10A,that is, the memory cell area 101. The plurality of lower electrodes 16arranged in the memory cell area 101 form a plurality of lower electrodegroups extending in an X direction. These lower electrode groups shallbe referred to as X1, X2, X3, . . . beginning at the top of the drawing.In order to realize the close-packing, the lower electrodes are arrangedsuch that the lower electrode groups X2, X4, . . . in even-numbered rowsare displaced in an X direction by a half pitch with respect to thelower electrode groups X1, X3, X5, . . . in odd-numbered rows.

FIG. 11 shows six etching openings 21. More specifically, they areopenings 21 aa and 21 ab formed to extend over the lower electrodegroups X2 and X3, an opening 21 b formed to extend over the lowerelectrodes X4 and X5, openings 21 ca and 21 cb formed to extend over thelower electrode groups X6 and X7, and an opening 21 d formed to extendover the lower electrode groups X8 and X9.

The openings 21 aa, 21 ab and the openings 21 ca, 21 cb have the samesize. The opening 21 b and the opening 21 d also have the same size, andare longer than the openings 21 aa, 21 ab and openings 21 ca, 21 cb inthe X direction.

The opening 21 aa is formed so as to expose a part of the outer walls ofeight lower electrodes 16 in total, namely, lower electrodes A, B, C, Dbelonging to the lower electrode group X2 and lower electrodes E, F, G,and H belonging to the lower electrode group X3. This means that theopening 21 aa is formed to extend over two adjacent lower electrodegroups. Likewise, the other etching openings 21 are also formed toextend over two adjacent lower electrode groups.

The aforementioned arrangement of the etching openings 21 isillustrative only, and other different arrangement of the openings 21may be employed. For example, only the openings 21 b and 21 d can beprovided, or only the openings 21 aa, 21 ab, 21 ca, and 21 cb can beprovided. Alternatively, the longitudinal direction of the openings 21can be different from the one shown in the drawing. For example, one ofthe openings 21 may be formed so as to expose a part of the outer wallsof the lower electrodes A, G, I, R, Q, J, F, and B shown in FIG. 11. Inthis case as well, the etching openings 21 are formed so as not tocompletely include any of the lower electrodes. This is because when oneof the etching openings 21 is formed to include the lower electrodes A,G, I, R, Q, J, F, B, C, E, K, and P, for example, the lower electrodes Fand J located near a central part are isolated from the first supportmember 30. In this case, the lower electrodes F and J will not able tobe supported by the first support member and may possibly collapse.Therefore, the etching openings 21 should be formed such that contactbetween each of the lower electrodes 16 and the first support member 30is maintained at least partially.

The first support member 30 is not a beam connecting between the lowerelectrodes as the one used in the related-art semiconductor devicemanufacturing method, but it has a shape planarly spreading. In thisembodiment of the invention, the outer walls of most of the lowerelectrodes 16 are in contact with the first support member 30 at theirentire outer periphery. Even a lower electrode 16 which is partiallyexposed in an etching opening 21 formed in a part of the first supportmember 30 is connected to the first support member 30 at its outer wallother than the outer wall located in the opening.

According to this embodiment, as described above, each of the lowerelectrodes 16 formed in the memory cell area 101 is connected to thefirst support member 30 spreading planarly continuously at a part of itsouter wall in the entire or part of the periphery thereof.

In FIG. 11, each of the lower electrodes belonging to the lowerelectrode group X1 in a support region XS1 is connected to the firstsupport member 30 at a part of its outer wall in the entire periphery.The same goes for the lower electrodes belonging to the lower electrodegroup X10.

When viewed in a Y direction as well, each of the lower electrodes 16located in a support region YS1 is connected to the first support member30 at a part of its outer wall in the entire periphery thereof. Asupport region YS2 is defined by a region which connects the supportregion XS1 and a support region XS2 planarly in a Y direction.

The second support member 31 located in a lower layer assumes the sameconfiguration as the first support member 30.

Returning to the description of the manufacturing processes, aftertotally removing the first, second and third cylinder interlayer films5, 7 and 9, a capacity insulating film 22 is formed on the entiresurface including the inner surfaces and outer wall surfaces of thelower electrodes 16, as shown in FIGS. 12A and 12B. The capacityinsulating film 22 is also formed on the surfaces of the first supportmember 30 and second support member 31, and on the upper surface of thestopper silicon nitride film 4. The capacity insulating film 22 can beformed of a single-layer film selected from a group consisting of azirconium oxide film, an aluminum oxide film, a titanium oxide film, atantalum oxide film, and a hafnium oxide film, or a laminated filmconsisting of a plurality of films selected from the group mentionedabove. All of these films can be formed by an ALD method. The capacityinsulating film 22 has a thickness of 6 nm, for example.

After the formation of the capacity insulating film 22, an upperelectrode 23 is formed to cover the surface of the capacity insulatingfilm 22 and to fill the gaps between the lower electrodes 16. The upperelectrode 23 is formed, for example, by sequentially stacking a titaniumnitride film, a boron-doped silicon film, and a boron-dopedsilicon-germanium film by a CVD process.

In this embodiment, position control is performed such that the uppersurface of the first support member 30 is situated at a lower level thanthe upper surfaces of the lower electrodes 16. This position control iscarried out by means of the thickness of the third cylinder interlayerfilm 9. If the level of the upper surface of the first support member 30is the same as the level of the upper surfaces of the lower electrodes16, the openings of the lower electrodes 16 will be closed by thecapacity insulating film 22 when it is formed. In order to avoid this,the upper surfaces of the lower electrodes 16 are formed to projectabove the upper surface of the first support member 30. The height ofthe parts of the lower electrodes 16 projecting above the first supportfilm 30 must be at least four times greater than the thickness of thecapacity insulating film 22. When the capacity insulating film 22 has athickness of 6 nm, the third cylinder interlayer film 9 may have athickness of 30 nm.

Next, a tungsten film is formed on the entire surface so as to cover theupper electrode 23. A mask is formed on the tungsten film to cover thememory cell area, and then the tungsten film formed on the peripheralcircuit area 102 and the upper electrode 23 located below the same areremoved by etching. Thus, as shown in FIG. 13, a plate-like tungstenfilm 24 is formed on the upper electrode 23 in the memory cell area 101.

After that, an interlayer insulation film 25 is formed on the entiresurface, and then the interlayer insulation film 25 formed on the memorycell area 101 is removed by a CMP process or the like. The interlayerinsulation film 25 remains in the peripheral circuit area 102 and thesurface thereof is planarized so as to be flush with the surface of thetungsten film 24.

Then, an interlayer insulation film 26 is formed on the entire surfaceto cover the planarized interlayer insulation film 25 and the tungstenfilm 24. Subsequently, a contact plug 27 connected to a wiring 2 formedin the peripheral circuit area 102 and a contact plug 28 connected tothe plate-like tungsten film 24 are formed. Further, wirings 29connected to the contact plugs 27 and 28 are formed.

After that, an interlayer insulation film and wirings not shown arefurther formed if required, and a DRAM is completed.

According to this embodiment, a plurality of support films is formed instack. First openings are formed in an upper-layer support film andsecond openings are formed in a lower-layer support film by using thefirst openings. In this manner, the number of photolithography stepsrequiring alignment can be reduced.

In other words, according to this embodiment, openings are formed inboth the second silicon nitride film 8 and the first silicon nitridefilm 6 by utilizing a single lithography step performed after theformation of the lower electrodes 16. This makes it possible to preventmisalignment possibly caused by repeated lithography steps.

Further, according to the embodiment, the area of the openings formed inthe second silicon nitride film 8 and the first silicon nitride film 6is made as small as possible, and the lower electrodes 16 areinterconnected by means of planar support members 30 and 31 spreadingtwo-dimensionally. This configuration is able to improve the mechanicalstrength in comparison with the case in which the lower electrodes areconnected by means of linear beams.

When the lower electrodes are connected by means of linear beams, thearrangement of the beams becomes more difficult and deterioration inmechanical strength becomes inevitable as the density of the lowerelectrodes is increased. In contrast, in the configuration according tothis embodiment, the arrangement of the support members 30 and 31 willnot become difficult even if the density of the lower electrodes 16 isincreased, and the deterioration in mechanical strength can beprevented. As a result, improvement of the yield in manufacturingsemiconductor devices and the reliability of products can be realized.

Next, a manufacturing method of a semiconductor device according to asecond embodiment of the invention will be described with reference toFIGS. 14A to 16B. The description will be made focusing on differentpoints from the first embodiment.

Firstly, in the same manner as in the first embodiment, the state asshown in FIGS. 8A and 8B is obtained.

The second cylinder interlayer film 7 is then totally removed by etchingwith use of a hydrofluoric-acid-containing solution, whereby a state asshown in FIGS. 14A and 14B is obtained. The upper surface of the firstsilicon nitride film 6 is exposed by this solution etching.

During etching of the second cylinder interlayer film 7, the thirdcylinder interlayer film 9 is also etched from a lateral direction.However, when the third cylinder interlayer film 9 is a silicon oxidefilm formed by a HDP process, its etching rate can be reduced to aboutone tenth of the etching rate of the second cylinder interlayer film 7that is formed of an impurity-containing silicon oxide film. Therefore,the third cylinder interlayer film 9 partially remains even after thesecond cylinder interlayer film 7 has been completely removed. Further,since etching openings 21 are provided within a limited range as shownin FIG. 14A, the lateral etching amount of the third cylinder interlayerfilm 9 is substantially negligible.

Next, the first silicon nitride film 6 is dry etched byfluorine-containing plasma with the plasma silicon nitride film 17 usedas a mask, whereby a state as shown in FIGS. 15A and 15B is obtained.

This dry etching causes the plasma silicon nitride film 17 used as amask to disappear, and exposes a part of the upper surface of the firstcylinder interlayer film 5.

Since the second cylinder interlayer film 7 has been completely removedbefore this dry etching, there exists a wide space between the mask andthe first silicon nitride film 6 as shown in FIG. 15B. Therefore, ionswhich contribute to the dry etching tend to scatter from a verticaldirection, generating scattered ions 33. The generation of the scatteredions 33 causes a part (indicated by a white out section) 31 b of thefirst silicon nitride film 6 to be dry etched. This means that openingsformed in the first silicon nitride film 6 will be slightly wider thanopenings formed in the second silicon nitride film 8. However, thisexpansion of the openings does not significantly affect interfaces 31 awhere the lower electrodes 16 are connected to the first silicon nitridefilm 6. As seen from FIG. 15A, this is because the interfaces 31 a arepresent behind lower electrodes 16 when viewed from the side where theions are incident. In other words, the lower electrodes 16 function asbarriers to prevent ions from reaching the interfaces 31 a. Thisprevents the interfaces 31 a between the lower electrodes 16 and thefirst silicon nitride film 6 from being etched away, which ensures theconnection between the lower electrodes 16 and the first silicon nitridefilm 6.

After that, the first cylinder interlayer film 5 and the third cylinderinterlayer film 9 are totally removed with use of ahydrofluoric-acid-containing solution. As a result, as shown in FIGS.16A and 16B, the outer peripheral surfaces of the lower electrodes 16are exposed except the parts where the lower electrodes 16 are connectedwith the first support member 30 and the second support member 31. Afterthis, the same processes as those of the first embodiment are performedto complete a DRAM.

In the second embodiment as well, like in the first embodiment, themisalignment possibly caused by repeated lithography steps can beprevented. Further, the configuration in which the lower electrodes areinterconnected by planar support members can improve the mechanicalstrength in comparison with the related-art in which the lowerelectrodes are interconnected by linear beams, and hence can improve theyield in manufacturing semiconductor devices and the reliability ofproducts.

Referring to FIG. 17 to FIG. 20B, a manufacturing method of asemiconductor device according to a third embodiment of the inventionwill be described.

FIG. 17 is a cross-sectional view for explaining findings obtained bythe inventor of this invention in the course of intensive study andexperimentation, as a result of which this invention has been made.Before reaching this invention, the inventor has examined the adequacyof a configuration in which the upper parts of the lower electrodes aresupported by a single support film. The inventor has found that whensuch a configuration is employed, even though the lower electrode willnot collapse, distortion 72 will be generated in the lower electrodes 16located below a support film 71, as shown in FIG. 17, and thus theadjacent lower electrodes 16 might short-circuit with each other. Theinventor also found that the generation of the distortion isconcentrated in a part of each lower electrode 16 that corresponds to adepth range of 200 to 400 nm from the upper surface thereof. Further,the inventor has found that said range corresponds to a position where aphenomenon called bowing is caused. The bowing is a phenomenon in whichwhen cylinder holes used for formation of lower electrode 16 are formedby a dry etching process, they expand in a lateral direction.

Based on these findings, the semiconductor device manufacturing methodaccording to this third embodiment, which is a modification of themanufacturing method according to the first or second embodiment, formsa third support film in those sites where bowing may occur. This will bedescribed in detail below.

Firstly, in order to obtain a state as shown in FIGS. 18A and 18B, aplurality of films are formed on a semiconductor substrate 1 on whichcircuits or the like have been formed in the same manner as in the firstembodiment. The third embodiment differs from the first embodiment inthat in order to arrange a third silicon nitride film between the firstsilicon nitride film 6 and the second silicon nitride film 8, the secondcylinder interlayer film 7 is divided into a lower layer 7 a (secondsacrificial film) and an upper layer 7 b (third sacrificial film), and athird silicon nitride film 81 (third support film) is formed betweenthese layers. The third silicon nitride film 81 can be formed in thesame manner as the first or second silicon nitride film 6 or 8.

Next, likewise the first embodiment, the cylinder hole pattern 13 of thephotoresist 12 is transferred to the silicon oxide film 11, and then thecylinder hole pattern 13 is further transferred to the amorphous carbonfilm 10. Using the amorphous carbon film 10 as a mask, the thirdcylinder interlayer film 9, the second silicon nitride film 8, the upperlayer second cylinder interlayer film 7 b, the third silicon nitridefilm 81, the lower layer second cylinder interlayer film 7 a, the firstsilicon nitride film 6, the first cylinder interlayer film 5, and thestopper silicon nitride film 4 are sequentially etched by a dry etchingprocess using fluorine-containing plasma, so that cylinder holes 14 areformed as shown in FIGS. 19A and 19B.

After that, the lower electrodes 16 are formed by the same processes asin the first embodiment. Further, etching openings 21 are formed in thesecond silicon nitride film 8, the upper layer second cylinderinterlayer film 7 b, the third silicon nitride film 81, the lower layersecond cylinder interlayer film 7 a, and the first silicon nitride film6. This means that the openings in the first silicon nitride film 6 aswell as the openings (third openings) in the third silicon nitride filmare formed by a single dry etching process. Further, the upper layersecond cylinder interlayer film 7 b, the lower layer second cylinderinterlayer film 7 a and the first cylinder interlayer film 5 arecompletely removed to expose the outer peripheral walls of the lowerelectrodes. An upper electrode 23 is then formed to obtain a state asshown in FIGS. 20A and 20B.

After that, interlayer insulation films, wiring and so on as necessaryare formed in the same manner as in the first embodiment, whereby a DRAMis completed.

While the semiconductor device manufacturing method in which the thirdsilicon nitride film is provided as a third support member by the sameprocesses as those of the first embodiment has been described above, itis also possible to manufacture a semiconductor device having the thirdsilicon nitride film as a third support member, by the same processes asthose of the second embodiment.

According to this third embodiment in which three support films areprovided, the mechanical strength is improved, and the lower electrodescan be effectively prevented from collapsing or distortion.Additionally, the support film provided at a position corresponding to adepth of 200 nm to 400 nm below the cylinder top is able to preventoccurrence of bowing during formation of the cylinder holes (during dryetching).

Although the invention has been described based on several exemplaryembodiments thereof, the invention is not limited to these embodimentsbut may be variously modified or changed. For example, the invention isapplicable not only to DRAMs but also to other semiconductor devices.Further, the first support film according to the first and secondembodiments can be provided at a position where bowing tends to occurduring formation of the cylinder holes. This makes it possible toeffectively prevent the lower electrodes from collapsing and distortion.

What is claimed is:
 1. A manufacturing method of a device comprising:sequentially forming a stopper film, a first sacrificial film, a firstsupport film, a second sacrificial film, a second support film, and amask silicon film over a semiconductor substrate having a memory cellarea and a peripheral circuit area; forming a hole pattern in the masksilicon film positioned in the memory cell area; forming a hole passingthrough the second support film, the second sacrificial film, the firstsupport film, the first sacrificial film, and the stopper film using ofthe mask silicon film as a mask; forming a crown-shaped electrodecovering an inner surface of the hole and connected to the secondsupport film, the first support film, and the stopper film; forming afirst opening in the second support film positioned in the memory cellarea into an opening pattern which is designed such that a connectionbetween the crown-shaped electrode and the second support film is atleast partially maintained, and simultaneously forming a firstperipheral opening in the peripheral circuit area by removing the secondsupport film; removing at least a part of the second sacrificial filmpositioned in the memory cell area through the first opening, andsimultaneously removing the second sacrificial film positioned in theperipheral circuit area through the first peripheral opening; forming asecond opening in the first support film positioned in the memory cellarea with use of the first opening, and simultaneously forming a secondperipheral opening by removing the first support film positioned in theperipheral circuit area with use of the first peripheral opening; andremoving the first sacrificial film through the second opening and thesecond peripheral opening respectively.
 2. The manufacturing method of adevice according to claim 1, wherein the formation of the second openingand the second peripheral opening are performed by anisotropic dryetching at same time.
 3. The manufacturing method of a device accordingto claim 2, wherein the formation of the first opening and the firstperipheral opening, the partial removal of the second sacrificial filmin the memory cell area and removal of the second sacrificial film inthe peripheral circuit area, and the formation of the second opening andthe second peripheral opening are carried out successively by a singledry etching step.
 4. The manufacturing method of a device according toclaim 2, wherein after the formation of the first opening and the firstperipheral opening, the second sacrificial film is totally removed bysolution etching, and then the formation of the second opening and thesecond peripheral opening are performed by dry etching through the firstopening and the first peripheral opening respectively.
 5. Themanufacturing method of a device according to claim 1, wherein theopening pattern is designed such that an area of a remaining part of thesecond support film after the formation of the first opening is greaterthan an area of the first opening.
 6. The manufacturing method of adevice according to claim 1, wherein the first sacrificial film and thesecond sacrificial film are made of a silicon oxide film, and thestopper film, the first support film and the second support film aremade of the silicon nitride film.
 7. A manufacturing method of a devicecomprising: sequentially forming a stopper film, a first sacrificialfilm, a first support film, a second sacrificial film, a second supportfilm, a third sacrificial film, a third support film and a mask filmover a semiconductor substrate having a memory cell area and aperipheral circuit area; forming a hole pattern in the mask filmpositioned in the memory cell area; forming a hole passing through thethird support film, a third sacrificial film, the second support film,the second sacrificial film, the first support film, the firstsacrificial film, and the stopper film using of the mask film as a mask;forming a crown-shaped electrode covering an inner surface of the holeand connected to the third support film, the second support film, thefirst support film and the stopper film; forming a first opening in thethird support film positioned in the memory cell area into an openingpattern which is designed such that a connection between thecrown-shaped electrode and the third support film is at least partiallymaintained, and simultaneously forming a first peripheral opening in theperipheral circuit area by removing the third support film; removing atleast a part of the third sacrificial film positioned in the memory cellarea through the first opening, and simultaneously removing the thirdsacrificial film positioned in the peripheral circuit area through thefirst peripheral opening; forming a second opening in the second supportfilm positioned in the memory cell area with use of the first opening,and simultaneously forming a second peripheral opening by removing thesecond support film positioned in the peripheral circuit area with useof the first peripheral opening; removing at least a part of the secondsacrificial film positioned in the memory cell area through the secondopening, and simultaneously removing the second sacrificial filmpositioned in the peripheral circuit area through the second peripheralopening; forming a third opening in the first support film positioned inthe memory cell area with use of the second opening, and simultaneouslyforming a third peripheral opening by removing the first support filmpositioned in the peripheral circuit area with use of the secondperipheral opening; and removing the first sacrificial film through thethird opening and the third peripheral opening respectively.
 8. Themanufacturing method of a device according to claim 7, wherein theformation of the second opening, the third opening, the secondperipheral opening and the third peripheral opening are performed byanisotropic dry etching simultaneously.
 9. The manufacturing method of adevice according to claim 8, wherein the formation of the first openingand the first peripheral opening, the partial removal of the thirdsacrificial film in the memory cell area and removal of the thirdsacrificial film in the peripheral circuit area, and the formation ofthe second opening and the second peripheral opening, the partialremoval of the second sacrificial film in the memory cell area andremoval of the second sacrificial film in the peripheral circuit area,and the formation of the third opening and the third peripheral openingare carried out successively by a single dry etching step.
 10. Themanufacturing method of a device according to claim 8, wherein after theformation of the first opening and the first peripheral opening, thethird sacrificial film is totally removed by solution etching, and thenthe formation of the second opening and the second peripheral openingare performed by dry etching through the first opening and the firstperipheral opening respectively, and then the second sacrificial film istotally removed by solution etching, and then the forming of the thirdopening and the third peripheral opening are performed by dry etchingthrough the second opening and the second peripheral openingrespectively.
 11. The manufacturing method of a device according toclaim 7, wherein the opening pattern is designed such that an area of aremaining part of the third support film after the formation of thefirst opening is greater than an area of the first opening.
 12. Themanufacturing method of a device according to claim 7, wherein the firstsacrificial film, the second sacrificial film and the third sacrificialfilm are made of a silicon oxide film, and the stopper film, the firstsupport film, the second support film and the third support film aremade of the silicon nitride film.
 13. The manufacturing method of adevice according to claim 7, wherein the mask film includes metallicfilm.
 14. The manufacturing method of a device according to claim 13,wherein the metallic film is a metal silicide film such as tungstensilicide or titanium silicide.
 15. The manufacturing method of a deviceaccording to claim 13, wherein the metallic film is a metal compoundfilm such as titanium nitride or tungsten nitride.
 16. The manufacturingmethod of a device according to claim 13, wherein the metallic film is ametal film such as aluminum, tungsten, or nickel.